PMMA CHIMEI CM‑207

PMMA CHIMEI CM‑207

PMMA CHIMEI CM‑207 is general‑purpose injection‑molding polymethyl methacrylate. It features good flowability, excellent transparency, favorable weather‑resistance, moderate heat‑resistance and balanced mechanical properties for multiple‑field applications.

Main Applications

Electrical & electronics: nameplates, speaker panels, instrument housings, electronic outer covers.

Automotive industry: taillights, signal lamp assemblies.

Optical components: sunglass lenses.

Mechanical parts: general‑purpose mechanical components.

Consumer goods: home‑appliance parts, stationery.

Properties

表格

Property Category Item Test Standard Value Unit
Physical Density ASTM D792 1.19 g/cm³
  Water absorption (24 h) ASTM D570 0.3 %
  MFR(230℃/3.8 kg) ASTM D1238 8.0‑9.0 g/10min
  Bulk density ASTM D1182 0.77 g/cm³
  Molding shrinkage ASTM D955 0.002‑0.006 mm/mm
  Refractive index ASTM D542 1.491
  Light transmittance (3.2 mm) ASTM D1003 92‑93 %
Mechanical Tensile strength (break) ASTM D638 71.6 MPa
  Elongation at break ASTM D638 5.0‑10 %
  Flexural strength ASTM D790 114 MPa
  Rockwell hardness‑M ASTM D785 M85‑M90
  Izod notched impact ASTM D256 12 J/m
  Charpy un‑notched impact ISO 180/1U 1.70 kJ/m²
Thermal HDT 1.8 MPa(un‑annealed) ASTM D648 / ISO 75‑2/A 79‑92
  Vicat B50 ASTM D1525 / ISO 306/A50 105‑115
Electrical Volume resistivity ASTM D257 10¹⁵ Ω·cm
  Dielectric strength ASTM D149 500 V/mil
  Dielectric constant (1 MHz) ASTM D150 3.7
  Dissipation factor (1 MHz) ASTM D150 0.019‑0.05
Flammability UL94 (1.5 mm) UL94 HB class

Injection‑Molding Parameters

表格

Process Item Recommendation Notes
Predrying Drying temperature 85‑90 ℃ Desiccant dryer required; target moisture<0.1 %
  Drying time 4 h Prevent silver‑streaks & bubbles
Barrel setting Nozzle 200‑230 ℃ Adopt shallow‑flight screw to avoid frictional degradation / yellowing
  Front zone 210‑230 ℃  
  Middle zone 200‑220 ℃  
  Rear zone 180‑200 ℃ Decomposition temperature>270 ℃, avoid long residence time
  Melt temperature 210‑230 ℃  
  Mold temperature 50‑70 ℃ High viscosity & fast cooling, easy to generate internal stress
  Injection speed Medium Excess speed brings surface defects & internal stress
  Back pressure 0.5‑1.0 MPa Low back‑pressure for melt homogenization

Note: All data for reference only, follow official TDS for mass‑production.

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